Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor

Shaobo Liu, Jingyi Zhang, Qing Wu, Qinru Qiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Scopus citations

Abstract

In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to the cores close to the heat sink and cool jobs to the cores far from the heat sink, subject to thermal constraints. The direct effect of the proposed algorithm on a 3D-CMP system is that, the heat from hot jobs is removed off the chip faster than the temperature-aware methods. Therefore we are able to keep the chip cooler and in better thermal condition. Experimental results show that, comparing to the temperature-aware method, our algorithm achieves: 1) less hot spots; 2) better performance; 3) smaller temporal temperature variation; 4) lower peak temperature. The proposed algorithm reduces hot spots by more than 95% when workload contains cool jobs; and by 36% when workload does not contain cool jobs. It also boosts the system performance by 5% on average under various workloads. The temporal temperature variation is reduced by 60% and its standard deviation is decreased by 50%. In addition, the proposed algorithm achieves 1.8°C-5°C reduction in peak temperature.

Original languageEnglish (US)
Title of host publicationProceedings of the 11th International Symposium on Quality Electronic Design, ISQED 2010
Pages390-398
Number of pages9
DOIs
StatePublished - 2010
Externally publishedYes
Event11th International Symposium on Quality Electronic Design, ISQED 2010 - San Jose, CA, United States
Duration: Mar 22 2010Mar 24 2010

Other

Other11th International Symposium on Quality Electronic Design, ISQED 2010
CountryUnited States
CitySan Jose, CA
Period3/22/103/24/10

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Keywords

  • Chip multiprocessor
  • Job allocation
  • Scheduling
  • Thermal management
  • Three dimensional

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Liu, S., Zhang, J., Wu, Q., & Qiu, Q. (2010). Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor. In Proceedings of the 11th International Symposium on Quality Electronic Design, ISQED 2010 (pp. 390-398). [5450547] https://doi.org/10.1109/ISQED.2010.5450547