The mechanical behavior of polyarylsulfone

R. J. Wann, G. C. Martin, W. W. Gerberich

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

A detailed study of the fracture behavior of polyarylsulfone was conducted over a temperature range of −175 to 120°C. Both fatigue crack propagation and fracture toughness tests were run as well as forced torsion pendulum tests to characterize the dynamic properties. The polymer exhibited a broad secondary loss peak and a high glass transition temperature at −110 and 295°C, respectively. Fracture toughness, KIC, and fatigue crack growth resistance were found to vary similarly with temperature, minima being observed near −50°C. Below that temperature, both a rise in toughness and in fatigue resistance is associated with the broad secondary loss peak. The slopes of the log fatigue crack velocity (da/dN) vs log stress intensity range (ΔK) curves varied from 2.6 to 13.2. Since the equation da/dN = α(ΔK)n described all of the data, the log‐log slope or exponent, n = ∂ln(da/dN)∂ln ΔK, was considered as a stress intensity sensitivity index with respect to fatigue behavior. This index was at a maximum near −50°C, where the minimum in toughness occurred. A kinetic model was utilized to correlate the stress intensity sensitivity index and suggested that a single thermally activated mechanism controls the low temperature mechanical behavior of polyarylsulfone.

Original languageEnglish (US)
Pages (from-to)645-651
Number of pages7
JournalPolymer Engineering and Science
Volume16
Issue number9
DOIs
StatePublished - 1976
Externally publishedYes

Fingerprint

Fatigue crack propagation
Toughness
Fracture toughness
Fatigue of materials
Temperature
Pendulums
Torsional stress
Polymers
Kinetics
Glass transition temperature
Fatigue cracks

ASJC Scopus subject areas

  • Chemistry(all)
  • Polymers and Plastics
  • Materials Chemistry

Cite this

Wann, R. J., Martin, G. C., & Gerberich, W. W. (1976). The mechanical behavior of polyarylsulfone. Polymer Engineering and Science, 16(9), 645-651. https://doi.org/10.1002/pen.760160908

The mechanical behavior of polyarylsulfone. / Wann, R. J.; Martin, G. C.; Gerberich, W. W.

In: Polymer Engineering and Science, Vol. 16, No. 9, 1976, p. 645-651.

Research output: Contribution to journalArticle

Wann, RJ, Martin, GC & Gerberich, WW 1976, 'The mechanical behavior of polyarylsulfone', Polymer Engineering and Science, vol. 16, no. 9, pp. 645-651. https://doi.org/10.1002/pen.760160908
Wann, R. J. ; Martin, G. C. ; Gerberich, W. W. / The mechanical behavior of polyarylsulfone. In: Polymer Engineering and Science. 1976 ; Vol. 16, No. 9. pp. 645-651.
@article{9a4f9e1c16b44cafbd29cccea78b3292,
title = "The mechanical behavior of polyarylsulfone",
abstract = "A detailed study of the fracture behavior of polyarylsulfone was conducted over a temperature range of −175 to 120°C. Both fatigue crack propagation and fracture toughness tests were run as well as forced torsion pendulum tests to characterize the dynamic properties. The polymer exhibited a broad secondary loss peak and a high glass transition temperature at −110 and 295°C, respectively. Fracture toughness, KIC, and fatigue crack growth resistance were found to vary similarly with temperature, minima being observed near −50°C. Below that temperature, both a rise in toughness and in fatigue resistance is associated with the broad secondary loss peak. The slopes of the log fatigue crack velocity (da/dN) vs log stress intensity range (ΔK) curves varied from 2.6 to 13.2. Since the equation da/dN = α(ΔK)n described all of the data, the log‐log slope or exponent, n = ∂ln(da/dN)∂ln ΔK, was considered as a stress intensity sensitivity index with respect to fatigue behavior. This index was at a maximum near −50°C, where the minimum in toughness occurred. A kinetic model was utilized to correlate the stress intensity sensitivity index and suggested that a single thermally activated mechanism controls the low temperature mechanical behavior of polyarylsulfone.",
author = "Wann, {R. J.} and Martin, {G. C.} and Gerberich, {W. W.}",
year = "1976",
doi = "10.1002/pen.760160908",
language = "English (US)",
volume = "16",
pages = "645--651",
journal = "Polymer Engineering and Science",
issn = "0032-3888",
publisher = "John Wiley and Sons Inc.",
number = "9",

}

TY - JOUR

T1 - The mechanical behavior of polyarylsulfone

AU - Wann, R. J.

AU - Martin, G. C.

AU - Gerberich, W. W.

PY - 1976

Y1 - 1976

N2 - A detailed study of the fracture behavior of polyarylsulfone was conducted over a temperature range of −175 to 120°C. Both fatigue crack propagation and fracture toughness tests were run as well as forced torsion pendulum tests to characterize the dynamic properties. The polymer exhibited a broad secondary loss peak and a high glass transition temperature at −110 and 295°C, respectively. Fracture toughness, KIC, and fatigue crack growth resistance were found to vary similarly with temperature, minima being observed near −50°C. Below that temperature, both a rise in toughness and in fatigue resistance is associated with the broad secondary loss peak. The slopes of the log fatigue crack velocity (da/dN) vs log stress intensity range (ΔK) curves varied from 2.6 to 13.2. Since the equation da/dN = α(ΔK)n described all of the data, the log‐log slope or exponent, n = ∂ln(da/dN)∂ln ΔK, was considered as a stress intensity sensitivity index with respect to fatigue behavior. This index was at a maximum near −50°C, where the minimum in toughness occurred. A kinetic model was utilized to correlate the stress intensity sensitivity index and suggested that a single thermally activated mechanism controls the low temperature mechanical behavior of polyarylsulfone.

AB - A detailed study of the fracture behavior of polyarylsulfone was conducted over a temperature range of −175 to 120°C. Both fatigue crack propagation and fracture toughness tests were run as well as forced torsion pendulum tests to characterize the dynamic properties. The polymer exhibited a broad secondary loss peak and a high glass transition temperature at −110 and 295°C, respectively. Fracture toughness, KIC, and fatigue crack growth resistance were found to vary similarly with temperature, minima being observed near −50°C. Below that temperature, both a rise in toughness and in fatigue resistance is associated with the broad secondary loss peak. The slopes of the log fatigue crack velocity (da/dN) vs log stress intensity range (ΔK) curves varied from 2.6 to 13.2. Since the equation da/dN = α(ΔK)n described all of the data, the log‐log slope or exponent, n = ∂ln(da/dN)∂ln ΔK, was considered as a stress intensity sensitivity index with respect to fatigue behavior. This index was at a maximum near −50°C, where the minimum in toughness occurred. A kinetic model was utilized to correlate the stress intensity sensitivity index and suggested that a single thermally activated mechanism controls the low temperature mechanical behavior of polyarylsulfone.

UR - http://www.scopus.com/inward/record.url?scp=84989102032&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84989102032&partnerID=8YFLogxK

U2 - 10.1002/pen.760160908

DO - 10.1002/pen.760160908

M3 - Article

VL - 16

SP - 645

EP - 651

JO - Polymer Engineering and Science

JF - Polymer Engineering and Science

SN - 0032-3888

IS - 9

ER -