RHEOLOGICAL ANALYSIS OF THE CURE BEHAVIOR OF EPOXY RESINS.

A. V. Tungare, G. C. Martin, J. T. Gotro

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

Polymer composites are widely used in the lamination or packaging of electrical circuits into multilayered circuit boards. In order to produce an electrically insulating and structurally reinforcing composite, the polymer resin must flow around the circuit information and cure to form a highly crosslinked network. Hence, it is essential to understand the chemorheology of the resin to determine the optimum processing conditions for lamination. During the lamination of polymer composites, the resin viscosity decreases with increasing temperature and increases with the crosslinking concentration. The primary objective of the study was to investigate the chemorheological behavior of several thermosetting resins by characterizing the viscosity variation with time, temperature, and thermal history using Squeezing Flow Viscometry. The viscosity data were analyzed to determine the kinetics of network formation or flow.

Original languageEnglish (US)
Pages (from-to)330-334
Number of pages5
JournalAnnual Technical Conference - Society of Plastics Engineers
StatePublished - Dec 1 1987

ASJC Scopus subject areas

  • Engineering(all)

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