RESIDUAL FATIGUES IN MICROELECTRONIC DEVICES DUE TO THERMOELASTIC STRAINS CAUSED BY REPETITIVE ELECTRICAL OVERSTRESSINGS: A MODEL FOR LATENT FAILURES.

Perambur S. Neelakantaswamy, Tapan K. Sarkar, Ibrahim R. Turkman

Research output: Contribution to journal › Conference Article › peer-review

7 Scopus citations

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