Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits

Daniela F. Bogorin, Matthew Ware, D. T. McClure, Stephen Sorokanich, B. L.T. Plourde

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.

Original languageEnglish (US)
Title of host publication2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013
DOIs
StatePublished - Oct 15 2013
Event2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013 - Cambridge, MA, United States
Duration: Jul 7 2013Jul 11 2013

Publication series

Name2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013

Other

Other2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013
CountryUnited States
CityCambridge, MA
Period7/7/137/11/13

Keywords

  • 3D cavity resonators
  • cQED
  • cavity quality factor
  • superconducting qubits
  • transmon

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Bogorin, D. F., Ware, M., McClure, D. T., Sorokanich, S., & Plourde, B. L. T. (2013). Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits. In 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013 [6604283] (2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013). https://doi.org/10.1109/ISEC.2013.6604283