Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits

Daniela F. Bogorin, Matthew Ware, D. T. McClure, Stephen Sorokanich, Britton Plourde

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.

Original languageEnglish (US)
Title of host publication2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013
DOIs
StatePublished - 2013
Event2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013 - Cambridge, MA, United States
Duration: Jul 7 2013Jul 11 2013

Other

Other2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013
CountryUnited States
CityCambridge, MA
Period7/7/137/11/13

Fingerprint

Microwaves
Copper
Tin
Surface treatment
Aluminum
Experiments
Temperature

Keywords

  • 3D cavity resonators
  • cavity quality factor
  • cQED
  • superconducting qubits
  • transmon

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Bogorin, D. F., Ware, M., McClure, D. T., Sorokanich, S., & Plourde, B. (2013). Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits. In 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013 [6604283] https://doi.org/10.1109/ISEC.2013.6604283

Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits. / Bogorin, Daniela F.; Ware, Matthew; McClure, D. T.; Sorokanich, Stephen; Plourde, Britton.

2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013. 2013. 6604283.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bogorin, DF, Ware, M, McClure, DT, Sorokanich, S & Plourde, B 2013, Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits. in 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013., 6604283, 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013, Cambridge, MA, United States, 7/7/13. https://doi.org/10.1109/ISEC.2013.6604283
Bogorin DF, Ware M, McClure DT, Sorokanich S, Plourde B. Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits. In 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013. 2013. 6604283 https://doi.org/10.1109/ISEC.2013.6604283
Bogorin, Daniela F. ; Ware, Matthew ; McClure, D. T. ; Sorokanich, Stephen ; Plourde, Britton. / Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits. 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013. 2013.
@inproceedings{a720dc9684f24eb68f8aecf29f0d3b85,
title = "Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits",
abstract = "The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.",
keywords = "3D cavity resonators, cavity quality factor, cQED, superconducting qubits, transmon",
author = "Bogorin, {Daniela F.} and Matthew Ware and McClure, {D. T.} and Stephen Sorokanich and Britton Plourde",
year = "2013",
doi = "10.1109/ISEC.2013.6604283",
language = "English (US)",
isbn = "9781467363716",
booktitle = "2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013",

}

TY - GEN

T1 - Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits

AU - Bogorin, Daniela F.

AU - Ware, Matthew

AU - McClure, D. T.

AU - Sorokanich, Stephen

AU - Plourde, Britton

PY - 2013

Y1 - 2013

N2 - The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.

AB - The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.

KW - 3D cavity resonators

KW - cavity quality factor

KW - cQED

KW - superconducting qubits

KW - transmon

UR - http://www.scopus.com/inward/record.url?scp=84885191462&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84885191462&partnerID=8YFLogxK

U2 - 10.1109/ISEC.2013.6604283

DO - 10.1109/ISEC.2013.6604283

M3 - Conference contribution

SN - 9781467363716

BT - 2013 IEEE 14th InternationalSuperconductive Electronics Conference, ISEC 2013

ER -