Reduced rack exhaust temperature gradient via variable chassis flow rate

Thong Dang, Carine Serreli, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

An effective method of reducing the temperature gradient in data centers (or "hot" and "cold" spots) is to minimize the maximum temperature at the rack exit plane. For a given rack's heat load, one way to achieve this is to vary the chassis flow rate in such a way that the rack exit temperature gradient is small. In this paper, a simple algorithm based on the energy equation is developed to set the chassis flow rate such that the exit rack temperature is uniform. When compared to a constant chassis flow rate algorithm, the proposed method is demonstrated through CFD simulations to achieve significant reduction in maximum chassis inlet temperature for the same CRAH flow rate.

Original languageEnglish (US)
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages451-459
Number of pages9
DOIs
StatePublished - Dec 1 2011
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: Jul 6 2011Jul 8 2011

Publication series

NameASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume2

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period7/6/117/8/11

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Dang, T., Serreli, C., Khalifa, H. E., Schmidt, R. R., & Iyengar, M. (2011). Reduced rack exhaust temperature gradient via variable chassis flow rate. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 451-459). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2). https://doi.org/10.1115/IPACK2011-52067