Reduced rack exhaust temperature gradient via variable chassis flow rate

Thong Dang; Carine Serreli; H. Ezzat Khalifa; Roger R. Schmidt; Madhusudan Iyengar

doi:10.1115/IPACK2011-52067

Reduced rack exhaust temperature gradient via variable chassis flow rate

Thong Dang, Carine Serreli, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar

Department of Mechanical & Aerospace Engineering

Research output: Chapter in Book/Entry/Poem › Conference contribution

1 Scopus citations

Abstract

An effective method of reducing the temperature gradient in data centers (or "hot" and "cold" spots) is to minimize the maximum temperature at the rack exit plane. For a given rack's heat load, one way to achieve this is to vary the chassis flow rate in such a way that the rack exit temperature gradient is small. In this paper, a simple algorithm based on the energy equation is developed to set the chassis flow rate such that the exit rack temperature is uniform. When compared to a constant chassis flow rate algorithm, the proposed method is demonstrated through CFD simulations to achieve significant reduction in maximum chassis inlet temperature for the same CRAH flow rate.

Original language	English (US)
Title of host publication	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages	451-459
Number of pages	9
DOIs	https://doi.org/10.1115/IPACK2011-52067
State	Published - 2011
Event	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States Duration: Jul 6 2011 → Jul 8 2011

Publication series

Name	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume	2

Other

Other	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Country/Territory	United States
City	Portland, OR
Period	7/6/11 → 7/8/11

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1115/IPACK2011-52067

Cite this

Dang, T., Serreli, C., Khalifa, H. E., Schmidt, R. R., & Iyengar, M. (2011). Reduced rack exhaust temperature gradient via variable chassis flow rate. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 451-459). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2). https://doi.org/10.1115/IPACK2011-52067

Reduced rack exhaust temperature gradient via variable chassis flow rate. / Dang, Thong; Serreli, Carine; Khalifa, H. Ezzat et al.
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. p. 451-459 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2).

Research output: Chapter in Book/Entry/Poem › Conference contribution

Dang, T, Serreli, C, Khalifa, HE, Schmidt, RR & Iyengar, M 2011, Reduced rack exhaust temperature gradient via variable chassis flow rate. in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, vol. 2, pp. 451-459, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, Portland, OR, United States, 7/6/11. https://doi.org/10.1115/IPACK2011-52067

Dang T, Serreli C, Khalifa HE, Schmidt RR, Iyengar M. Reduced rack exhaust temperature gradient via variable chassis flow rate. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. p. 451-459. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011). doi: 10.1115/IPACK2011-52067

Dang, Thong ; Serreli, Carine ; Khalifa, H. Ezzat et al. / Reduced rack exhaust temperature gradient via variable chassis flow rate. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. pp. 451-459 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011).

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author = "Thong Dang and Carine Serreli and Khalifa, {H. Ezzat} and Schmidt, {Roger R.} and Madhusudan Iyengar",

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AB - An effective method of reducing the temperature gradient in data centers (or "hot" and "cold" spots) is to minimize the maximum temperature at the rack exit plane. For a given rack's heat load, one way to achieve this is to vary the chassis flow rate in such a way that the rack exit temperature gradient is small. In this paper, a simple algorithm based on the energy equation is developed to set the chassis flow rate such that the exit rack temperature is uniform. When compared to a constant chassis flow rate algorithm, the proposed method is demonstrated through CFD simulations to achieve significant reduction in maximum chassis inlet temperature for the same CRAH flow rate.

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Reduced rack exhaust temperature gradient via variable chassis flow rate

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