Physical behavior of imidazole-cured epoxy resins

G. C. Martin, M. S. Heise, J. T. Gotro

Research output: Contribution to journalConference Articlepeer-review

2 Scopus citations


The purpose of this study was to analyze the physical behavior of epoxy resins cured with imidazoles. The network properties were analyzed by four different methods: Differential Scanning Calorimetry (DSC), extraction studies, dynamic mechanical analysis (DMA) and microdielectrometry. The network formation process was characterized by monitoring the glass transition temperature (Tg), the sol fraction, the ionic conductivity and the viscosity during the curing reaction. The results of these studies were compared to the results obtained from network formation modeling studies. The combined use of DMA, microdielectrometry, and extraction studies has been shown to be an effective approach for analyzing the network formation process for epoxy/imidazole systems. The reacting system is characterized by a 'loosely-formed' network swollen in unreacted monomer; therefore, the viscosity remains low during the initial stages of gel formation.

Original languageEnglish (US)
Pages (from-to)1070-1073
Number of pages4
JournalAnnual Technical Conference - Society of Plastics Engineers
StatePublished - 1989
EventANTEC 89 - 47th Annual Technical Conference of SPE - New York, NY, USA
Duration: May 1 1989May 4 1989

ASJC Scopus subject areas

  • General Engineering


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