TY - GEN
T1 - Overcoming the Upper Bound on the Bandwidth-to-Thickness Ratio of Ultrathin Absorbers
AU - Nayani, P. S.
AU - Ra'di, Y.
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In numerous applications from radio to optical frequencies, there is a need to design electrically thin layers capable of perfectly absorbing the incoming electromagnetic waves. From a practical point of view, there is an ever-growing need for thinner absorbing layers that provide higher absorption bandwidths. However, there is an upper bound on the bandwidth-to-thickness ratio of these absorbers. The thinner these absorbers get, the narrower absorption bandwidth they provide. Here, we introduce a new concept for designing ultra-thin absorbers that can go beyond this upper bound defined for conventional absorbers based on high-impedance surfaces. It is shown that the absorbers designed based on the proposed concept can provide several-fold higher absorption bandwidth compared to the same thickness absorbers designed based on conventional approaches.
AB - In numerous applications from radio to optical frequencies, there is a need to design electrically thin layers capable of perfectly absorbing the incoming electromagnetic waves. From a practical point of view, there is an ever-growing need for thinner absorbing layers that provide higher absorption bandwidths. However, there is an upper bound on the bandwidth-to-thickness ratio of these absorbers. The thinner these absorbers get, the narrower absorption bandwidth they provide. Here, we introduce a new concept for designing ultra-thin absorbers that can go beyond this upper bound defined for conventional absorbers based on high-impedance surfaces. It is shown that the absorbers designed based on the proposed concept can provide several-fold higher absorption bandwidth compared to the same thickness absorbers designed based on conventional approaches.
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U2 - 10.1109/Metamaterials58257.2023.10289481
DO - 10.1109/Metamaterials58257.2023.10289481
M3 - Conference contribution
AN - SCOPUS:85177575628
T3 - 17th International Congress on Artificial Materials for Novel Wave Phenomena, Metamaterials 2023
SP - 244
EP - 246
BT - 17th International Congress on Artificial Materials for Novel Wave Phenomena, Metamaterials 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th International Congress on Artificial Materials for Novel Wave Phenomena, Metamaterials 2023
Y2 - 11 September 2023 through 16 September 2023
ER -