Modification mechanisms, curing kinetics and properties of polymethylphenyl siloxane-modified epoxy resins

Man Zhang, George C. Martin

Research output: Contribution to conferencePaperpeer-review


The mechanisms of chemical modification of diglycidyl ether of a bisphenol A (DGEBA) epoxy resin modified with a methoxyl-terminated polymethylphenyl siloxane oligomer were characterized by Fourier Transform Infrared Spectroscopy, Thin Layer Chromatography, and Epoxy Equivalent Weight measurements. The curing behavior, the thermal and mechanical properties of the modified epoxy resins cured with meta-phenylenediamine were investigated as a function of the weight concentration of siloxane modifier. The activation energy and frequency factors were dependent on the siloxane content. For modified epoxy resins, an enhancement in thermal stability and the flexural and the tensile strength were observed, and the overall toughness was increased by three to four fold. The glass transition temperature and the flexural moduli of cured samples showed a decrease with an increase in the siloxane content.

Original languageEnglish (US)
Number of pages5
StatePublished - 2003
Event61st Annual Technical Conference ANTEC 2003 - Nashville, TN, United States
Duration: May 4 2003May 8 2003


Other61st Annual Technical Conference ANTEC 2003
Country/TerritoryUnited States
CityNashville, TN


  • Epoxy resin
  • Siloxane modification

ASJC Scopus subject areas

  • General Chemical Engineering
  • Polymers and Plastics


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