Modeling the rheological and dielectric properties during thermoset cure

G. C. Martin, A. V. Tungare

Research output: Contribution to journalConference article

6 Scopus citations

Abstract

In this study, simultaneous viscosity and ionic conductivity data, obtained under isothermal and dynamic temperature conditions, were analyzed using models for rheological and dielectric behavior. The model parameters were evaluated from the experimental data using numerical optimization and linear regression techniques. Epoxy resins with different degrees of B-staging were used to study the effects of B-staging on the model parameters and the resin fluidity. The otpimum Dual Arrhenius model parameters for the Dow Quatrex 5010 and the two FR-4 resins are reported. The parameters were determined from viscosity data during dynamic cure at 5, 7, 10, 15, and 20°C/min heating rates. The predicted and the experimental viscosity profiles for the two FR-4 resins are also compared. The experimental data and the model predictions at 123, 135, and 157°C isothermal temperatures are compared.

Original languageEnglish (US)
Pages (from-to)980-984
Number of pages5
JournalPolymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering
Volume59
StatePublished - Dec 1 1988
EventProceedings of the ACS Division of Polymeric Materials: Science and Engineering - Fall Meeting - Los Angeles, CA, USA
Duration: Sep 26 1988Sep 30 1988

ASJC Scopus subject areas

  • Chemical Engineering (miscellaneous)
  • Polymers and Plastics

Fingerprint Dive into the research topics of 'Modeling the rheological and dielectric properties during thermoset cure'. Together they form a unique fingerprint.

  • Cite this