TY - JOUR
T1 - Metasurface-Mediated Quantum Entanglement
AU - Jha, Pankaj K.
AU - Shitrit, Nir
AU - Kim, Jeongmin
AU - Ren, Xuexin
AU - Wang, Yuan
AU - Zhang, Xiang
N1 - Funding Information:
This work was supported by the U.S. Department of Energy Office of Science, Basic Energy Sciences, Materials Sciences and Engineering Division under Contract No. DE-AC02-05- CH11231 within the Subwavelength Metamaterials Program (KC12XZ) for design and analysis.
Funding Information:
This work was supported by the U.S. Department of Energy, Office of Science, Basic Energy Sciences, Materials Sciences and Engineering Division under Contract No. DE-AC02-05-CH11231 within the Subwavelength Metamaterials Program (KC12XZ) for design and analysis. Support was also provided by Samsung Electronics for simulation.
Publisher Copyright:
© 2017 American Chemical Society.
PY - 2018/3/21
Y1 - 2018/3/21
N2 - Entanglement-based quantum science exploits subtle properties of quantum mechanics into applications such as quantum computing, sensing, and metrology. The emerging route for quantum computing applications, which calls for ultracompact, integrated, and scalable architecture, aims at on-chip entangled qubits. In this context, quantum entanglement among atomic qubits was achieved via cold-controlled collisions which are only significant at subwavelength separations. However, as other manifolds of quantum state engineering require single-site addressability and controlled manipulation of the individual qubit using diffraction-limited optics, entanglement of qubits separated by macroscopic distances at the chip level is still an outstanding challenge. Here, we report a novel platform for on-chip quantum state engineering by harnessing the extraordinary light-molding capabilities of metasurfaces. We theoretically demonstrate quantum entanglement between two qubits trapped on a chip and separated by macroscopic distances, by engineering their coherent and dissipative interactions via the metasurface. Spatially scalable interaction channels offered by the metasurface enable robust generation of entanglement, with large values of concurrence and remarkable revival from sudden death. The metasurface route to quantum state engineering opens a new paradigm for on-chip quantum science and technologies.
AB - Entanglement-based quantum science exploits subtle properties of quantum mechanics into applications such as quantum computing, sensing, and metrology. The emerging route for quantum computing applications, which calls for ultracompact, integrated, and scalable architecture, aims at on-chip entangled qubits. In this context, quantum entanglement among atomic qubits was achieved via cold-controlled collisions which are only significant at subwavelength separations. However, as other manifolds of quantum state engineering require single-site addressability and controlled manipulation of the individual qubit using diffraction-limited optics, entanglement of qubits separated by macroscopic distances at the chip level is still an outstanding challenge. Here, we report a novel platform for on-chip quantum state engineering by harnessing the extraordinary light-molding capabilities of metasurfaces. We theoretically demonstrate quantum entanglement between two qubits trapped on a chip and separated by macroscopic distances, by engineering their coherent and dissipative interactions via the metasurface. Spatially scalable interaction channels offered by the metasurface enable robust generation of entanglement, with large values of concurrence and remarkable revival from sudden death. The metasurface route to quantum state engineering opens a new paradigm for on-chip quantum science and technologies.
KW - Metasurfaces
KW - quantum entanglement
KW - quantum state engineering
KW - single-photon operation
KW - wavefront molding
UR - http://www.scopus.com/inward/record.url?scp=85044302076&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85044302076&partnerID=8YFLogxK
U2 - 10.1021/acsphotonics.7b01241
DO - 10.1021/acsphotonics.7b01241
M3 - Article
AN - SCOPUS:85044302076
SN - 2330-4022
VL - 5
SP - 971
EP - 976
JO - ACS Photonics
JF - ACS Photonics
IS - 3
ER -