Limitations of DNA high-frequency anchoring and stretching

H. Dalir, T. Nisisako, T. Endo, Y. Yanagida, T. Hatsuzawa

Research output: Chapter in Book/Entry/PoemConference contribution

Abstract

This paper reports measurements that characterize the immobilization of 48 kilobase-pair lambda DNA onto lifted-off microelectrodes by high-voltage and high-frequency dielectrophoresis. Measurements of voltage- and frequency-dependent immobilization of DNA onto microelectrodes by dielectrophoresis show significant reduction in the response as the frequency increases from 200 kHz to 1 MHz or decreases from 200 kHz to 100 kHz and also as the electric field is lower or higher than 0.4 Vp-p/m. We found that the immobilization and elongation of the DNA molecules is restricted by the geometry of the gap, and that by decreasing the electrode gap size, the DNA molecules have less chance for both immobilization and stretching. The produced electrodes with both random microscopic peaks and modified smooth edges are utilized to show the effect of electrode edge roughness. The results imply that more DNA molecules can be immobilized by microelectrodes having rough edges.

Original languageEnglish (US)
Title of host publicationTechnical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, NSTI-Nanotech, Nanotechnology 2008
Pages312-315
Number of pages4
StatePublished - 2008
Event2008 NSTI Nanotechnology Conference and Trade Show, NSTI Nanotech 2008 Joint Meeting, Nanotechnology 2008 - Quebec City, QC, United States
Duration: Jun 1 2008Jun 5 2008

Publication series

NameTechnical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, NSTI-Nanotech, Nanotechnology 2008
Volume3

Other

Other2008 NSTI Nanotechnology Conference and Trade Show, NSTI Nanotech 2008 Joint Meeting, Nanotechnology 2008
Country/TerritoryUnited States
CityQuebec City, QC
Period6/1/086/5/08

Keywords

  • DNA manipulation
  • DNA stretching
  • Edge roughness
  • Gap geometry
  • High frequency measurements

ASJC Scopus subject areas

  • Mechanical Engineering

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