Laser-induced selective copper deposition on polyimides and semiconductors

Seong Don Hwang, S. S. Kher, J. T. Spencer, P. A. Dowben

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

It has been demonstrated that copper can be selectively deposited on a variety of substrates including Teflon (polytetrafluoroethylene or PTFE), Kapton (polyimide resin), silicon and gallium arsenide from solution by photo-assisted initiated deposition. A copper containing solution was prepared from a mixture of copper(I) chloride (Cu2Cl2) and decaborane (B10H14) in diethyl ether and/or THF (tetrahydrofuran). The copper films were fabricated by ultraviolet photolytic decomposition of copper chloride and polyhedral borane clusters. This liquid phase deposition has a gas-phase cluster analog that also results in copper deposition via pyrolysis. The approach of depositing metal thin films selectively by pholysis from solution is a novel and an underutilized approach to selective area deposition.

Original languageEnglish (US)
Title of host publicationChemical Perspectives of Microelectronic Materials III
PublisherPubl by Materials Research Society
Pages185-189
Number of pages5
ISBN (Print)1558991778
StatePublished - Jan 1 1993
EventProceedings of the 3rd Biennial Meeting of Chemical Perspectives of Microelectronic Materials - Boston, MA, USA
Duration: Nov 30 1992Dec 3 1992

Publication series

NameMaterials Research Society Symposium Proceedings
Volume282
ISSN (Print)0272-9172

Other

OtherProceedings of the 3rd Biennial Meeting of Chemical Perspectives of Microelectronic Materials
CityBoston, MA, USA
Period11/30/9212/3/92

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Hwang, S. D., Kher, S. S., Spencer, J. T., & Dowben, P. A. (1993). Laser-induced selective copper deposition on polyimides and semiconductors. In Chemical Perspectives of Microelectronic Materials III (pp. 185-189). (Materials Research Society Symposium Proceedings; Vol. 282). Publ by Materials Research Society.