Abstract
The ability for shape memory polymers (SMPs) to quickly actuate upon exposure to a heat transfer fluid or radiative heating depends significantly on thermal conductivity and heat capacity. Recognizing this, we have pursued the enhancement of thermal conductivity of several SMPs - developed previously in our laboratory through the addition of thermally conductive inorganic filler. Our presentation will focus on both thermal and thermomechanical analyses for filled and crosslinked polycyclooctene, revealing the dependence of thermal conductivity and shape memory response on filler loading.
Original language | English (US) |
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Pages | 3080-3084 |
Number of pages | 5 |
State | Published - 2004 |
Event | ANTEC 2004 - Annual Technical Conference Proceedings - Chicago, IL., United States Duration: May 16 2004 → May 20 2004 |
Other
Other | ANTEC 2004 - Annual Technical Conference Proceedings |
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Country/Territory | United States |
City | Chicago, IL. |
Period | 5/16/04 → 5/20/04 |
Keywords
- Boron Nitride
- Polycoclooctene
- Shape Memory Polymer
- Thermal Conductivity
ASJC Scopus subject areas
- General Chemical Engineering
- Polymers and Plastics