High thermal conductivity shape memory polymers

Changdeng Liu, Patrick T. Mather

Research output: Contribution to conferencePaperpeer-review

8 Scopus citations

Abstract

The ability for shape memory polymers (SMPs) to quickly actuate upon exposure to a heat transfer fluid or radiative heating depends significantly on thermal conductivity and heat capacity. Recognizing this, we have pursued the enhancement of thermal conductivity of several SMPs - developed previously in our laboratory through the addition of thermally conductive inorganic filler. Our presentation will focus on both thermal and thermomechanical analyses for filled and crosslinked polycyclooctene, revealing the dependence of thermal conductivity and shape memory response on filler loading.

Original languageEnglish (US)
Pages3080-3084
Number of pages5
StatePublished - Jun 1 2004
EventANTEC 2004 - Annual Technical Conference Proceedings - Chicago, IL., United States
Duration: May 16 2004May 20 2004

Other

OtherANTEC 2004 - Annual Technical Conference Proceedings
CountryUnited States
CityChicago, IL.
Period5/16/045/20/04

Keywords

  • Boron Nitride
  • Polycoclooctene
  • Shape Memory Polymer
  • Thermal Conductivity

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Polymers and Plastics

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