Frequency dependent characterization of a microstrip line over a perforated ground plane

Masoud Kahrizi, Tapan K. Sarkar, Zoran A. Maricevic

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The objective of this analysis is to determine the characteristic impedance and the propagation constant of a microstrip line over a perforated ground plane. The geometry of a microstrip line over a perforated ground plane is shown in Fig. 1. The ground plane contains a finite number of small rectangular apertures in an area below the microstrip line and around it. The solution uses the equivalence principle to replace the apertures with oppositely directed equivalent magnetic currents on both sides of the ground plane. Therefore the problem is decomposed into two isolated problems "a" and "b". Problem "a" belongs to the region above the ground plane and problem "b" is valid for the region below the ground plane.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages87-89
Number of pages3
ISBN (Electronic)078030683X, 9780780306837
DOIs
StatePublished - Jan 1 1992
Event1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States
Duration: Apr 22 1992Apr 24 1992

Publication series

NameElectrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference1992 Electrical Performance of Electronic Packaging, EPEP 1992
CountryUnited States
CityTucson
Period4/22/924/24/92

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Kahrizi, M., Sarkar, T. K., & Maricevic, Z. A. (1992). Frequency dependent characterization of a microstrip line over a perforated ground plane. In Electrical Performance of Electronic Packaging, EPEP 1992 (pp. 87-89). [572273] (Electrical Performance of Electronic Packaging, EPEP 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1992.572273