Evaluation of excess inductance and capacitance of microstrip discontinuities

Tapan K. Sarkar, Zoran A. Maricevic, J. B. Zhang, Antonije R. Djordjevic

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper presents a technique for evaluation of excess inductance and capacitance of certain transmission line discontinuities (bends, mitered bends, impedance steps, tees and simple vias).This technique is fairly general and can treat any arbitrary shaped transmission line structure, assumed to be consisting of perfectly conducting foils located above a perfectly conducting ground plane, embedded in various dielectric la+yers. An estimate of the error bound is given.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages104-106
Number of pages3
ISBN (Electronic)078030683X, 9780780306837
DOIs
StatePublished - Jan 1 1992
Event1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States
Duration: Apr 22 1992Apr 24 1992

Publication series

NameElectrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference1992 Electrical Performance of Electronic Packaging, EPEP 1992
CountryUnited States
CityTucson
Period4/22/924/24/92

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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    Sarkar, T. K., Maricevic, Z. A., Zhang, J. B., & Djordjevic, A. R. (1992). Evaluation of excess inductance and capacitance of microstrip discontinuities. In Electrical Performance of Electronic Packaging, EPEP 1992 (pp. 104-106). [572278] (Electrical Performance of Electronic Packaging, EPEP 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1992.572278