Abstract
The invention discloses a novel method of controlling the open circuit potential (OCP) of a medical implant by coupling it with small amounts of metals having a lower OCP than the implant. Coupling of Mg to less than 1% of the surface area of a titanium implant is shown to induce cathodic polarization of the titanium that inhibits cell proliferation at the surface of the implant. Mg—Ti coupling in medical devices promises to attenuate or eliminate potential complications of surgery such as peri-implantitis and bacterial infections at the site of implantation.
| Original language | English (US) |
|---|---|
| Patent number | 9,039,764 |
| State | Published - Feb 3 2011 |