TY - GEN
T1 - Dynamic thermal management in mobile devices considering the thermal coupling between battery and application processor
AU - Xie, Qing
AU - Kim, Jaemin
AU - Wang, Yanzhi
AU - Shin, Donghwa
AU - Chang, Naehyuck
AU - Pedram, Massoud
PY - 2013
Y1 - 2013
N2 - The thermal management is a crucial design problem for mobile devices because it greatly affects not only the device reliability, but also the leakage energy consumption. Conventional dynamic thermal management (DTM) techniques work well for the computer systems. However, due to the limitation of the physical space in mobile devices, the thermal coupling effect between the major heat generation components, such as the application processor (AP) and the battery, plays an important role in determining the temperature inside the mobile device package. Due to this effect, the thermal behavior of one part is no longer independent of the other, but is affected by the temperature of other parts. This is the first work that quantitatively characterizes the thermal coupling between the battery and AP and presents a predictive DTM for mobile devices considering this effect. Simulation results show that the proposed DTM method significantly reduces the thermal violations for the target mobile devices.
AB - The thermal management is a crucial design problem for mobile devices because it greatly affects not only the device reliability, but also the leakage energy consumption. Conventional dynamic thermal management (DTM) techniques work well for the computer systems. However, due to the limitation of the physical space in mobile devices, the thermal coupling effect between the major heat generation components, such as the application processor (AP) and the battery, plays an important role in determining the temperature inside the mobile device package. Due to this effect, the thermal behavior of one part is no longer independent of the other, but is affected by the temperature of other parts. This is the first work that quantitatively characterizes the thermal coupling between the battery and AP and presents a predictive DTM for mobile devices considering this effect. Simulation results show that the proposed DTM method significantly reduces the thermal violations for the target mobile devices.
KW - dynamic thermal management
KW - smartphones
KW - thermal coupling effect
UR - http://www.scopus.com/inward/record.url?scp=84893348469&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893348469&partnerID=8YFLogxK
U2 - 10.1109/ICCAD.2013.6691125
DO - 10.1109/ICCAD.2013.6691125
M3 - Conference contribution
AN - SCOPUS:84893348469
SN - 9781479910717
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
SP - 242
EP - 247
BT - 2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers
T2 - 2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013
Y2 - 18 November 2013 through 21 November 2013
ER -