Dynamic thermal management in mobile devices considering the thermal coupling between battery and application processor

Qing Xie, Jaemin Kim, Yanzhi Wang, Donghwa Shin, Naehyuck Chang, Massoud Pedram

Research output: Chapter in Book/Report/Conference proceedingConference contribution

43 Scopus citations

Abstract

The thermal management is a crucial design problem for mobile devices because it greatly affects not only the device reliability, but also the leakage energy consumption. Conventional dynamic thermal management (DTM) techniques work well for the computer systems. However, due to the limitation of the physical space in mobile devices, the thermal coupling effect between the major heat generation components, such as the application processor (AP) and the battery, plays an important role in determining the temperature inside the mobile device package. Due to this effect, the thermal behavior of one part is no longer independent of the other, but is affected by the temperature of other parts. This is the first work that quantitatively characterizes the thermal coupling between the battery and AP and presents a predictive DTM for mobile devices considering this effect. Simulation results show that the proposed DTM method significantly reduces the thermal violations for the target mobile devices.

Original languageEnglish (US)
Title of host publication2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers
Pages242-247
Number of pages6
DOIs
StatePublished - Dec 1 2013
Event2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - San Jose, CA, United States
Duration: Nov 18 2013Nov 21 2013

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Other

Other2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013
CountryUnited States
CitySan Jose, CA
Period11/18/1311/21/13

Keywords

  • dynamic thermal management
  • smartphones
  • thermal coupling effect

ASJC Scopus subject areas

  • Software
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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  • Cite this

    Xie, Q., Kim, J., Wang, Y., Shin, D., Chang, N., & Pedram, M. (2013). Dynamic thermal management in mobile devices considering the thermal coupling between battery and application processor. In 2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers (pp. 242-247). [6691125] (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). https://doi.org/10.1109/ICCAD.2013.6691125