Dynamic thermal management for finfet-based circuits exploiting the temperature effect inversion phenomenon

Woojoo Lee, Yanzhi Wang, Tiansong Cui, Shahin Mazarian, Massoud Pedram

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Scopus citations

Abstract

Due to limits on the availability of the energy source in many mobile user platforms (ranging from handheld devices to portable electronics to deeply embedded devices) and concerns about how much heat can effectively be removed from chips, minimizing the power consumption has become a primary driver for system-on-chip designers. Because of their superb characteristics, FinFETs have emerged as a promising replacement for planar CMOS devices in sub-20nm CMOS technology nodes. However, based on extensive simulations, we have observed that the delay vs. temperature characteristics of FinFET-based circuits are fundamentally different from that of the conventional bulk CMOS circuits, i.e., the delay of a FinFET circuit decreases with increasing temperature even in the super-threshold supply voltage regime. Unfortunately, the leakage power dissipation of the FinFET-based circuits increases exponentially with the temperature. These two trends give rise to a tradeoff between delay and leakage power as a function of the chip temperature, and hence, lead to the definition of an optimum chip temperature operating point (i.e., one that balances concerns about the circuit speed and power efficiency.) This paper presents the results of our investigations into the aforesaid temperature effect inversion (TEI) and proposes a novel dynamic thermal management (DTM) algorithm, which exploits this phenomenon to minimize the energy consumption of FinFET-based circuits without any appreciable performance penalty. Experimental results demonstrate 40% energy saving (with no performance penalty) can be achieved by the proposed TEI-aware DTM approach compared to the best-in-class DTMs that are unaware of this phenomenon. Copyright is held by the owner/author(s).

Original languageEnglish (US)
Title of host publicationISLPED 2014 - Proceedings of the 2014 International Symposium on Low Power Electronics and Design
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages105-110
Number of pages6
ISBN (Print)9781450329750
DOIs
StatePublished - Jan 1 2014
Event2014 ACM/IEEE International Symposium on Low Power Electronics and Design, ISLPED 2014 - San Diego, CA, United States
Duration: Aug 11 2014Aug 13 2014

Publication series

NameProceedings of the International Symposium on Low Power Electronics and Design
ISSN (Print)1533-4678

Conference

Conference2014 ACM/IEEE International Symposium on Low Power Electronics and Design, ISLPED 2014
CountryUnited States
CitySan Diego, CA
Period8/11/148/13/14

Keywords

  • FinFET
  • Fow-power designs
  • Thermal management

ASJC Scopus subject areas

  • Engineering(all)

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    Lee, W., Wang, Y., Cui, T., Mazarian, S., & Pedram, M. (2014). Dynamic thermal management for finfet-based circuits exploiting the temperature effect inversion phenomenon. In ISLPED 2014 - Proceedings of the 2014 International Symposium on Low Power Electronics and Design (pp. 105-110). (Proceedings of the International Symposium on Low Power Electronics and Design). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/2627369.2627608