Diffusion of Cu on Cu surfaces

Majid Karimi, Tom Tomkowski, Gianfranco Vidali, Ofer Biham

Research output: Contribution to journalArticle

128 Scopus citations

Abstract

Diffusion of a single Cu adatom on low-index Cu surfaces with different morphologies (with and without the presence of other Cu adatoms as well as near and over stepped surfaces) is studied using the embedded-atom method and a molecular static simulation. Migration energies of a Cu adatom in the presence of other Cu adatoms which are relevant in computer simulations of island growth are calculated. We have also calculated the formation and migration energies of an adatom and a vacancy in different layers as well as formation energies of steps on various Cu surfaces. Step-step interaction is shown to be repulsive and consistent with elasticity theory. Our calculations predict a lower activation energy for diffusion of a vacancy than of an adatom for all three Cu surfaces.

Original languageEnglish (US)
Pages (from-to)5364-5374
Number of pages11
JournalPhysical Review B
Volume52
Issue number7
DOIs
StatePublished - Jan 1 1995

ASJC Scopus subject areas

  • Condensed Matter Physics

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    Karimi, M., Tomkowski, T., Vidali, G., & Biham, O. (1995). Diffusion of Cu on Cu surfaces. Physical Review B, 52(7), 5364-5374. https://doi.org/10.1103/PhysRevB.52.5364