Design of simulated server racks for data center research

James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

Conducting experiments on real high-density computer servers can be an expensive and risky task due to the risks associated with unintended inlet temperatures that exceed the server's red-line temperature limit. Presented herein is the development of the simulated chassis that mimic real computer servers. Briefly, twelve high-power simulated chassis were designed and built to accurately simulate the actual operating conditions of a real computer chassis in a data center. Each simulated chassis is designed to have approximately 300 Pa pressure drop at a flow rate of 600 cfm to represent a real IBM server chassis. Additionally, the simulated chassis are designed to match the thermal mass of a real server. Eight of the simulated chassis were designed to have constant speed fans and variable heating power while the remaining four chassis were designed to have variable speed fans and variable heating power. Further discussions about the design phase of the simulated chassis are the substantial part of this paper. Underlining the challenges and safety issues with high-power chassis, guidelines for designing and constructing a chassis that simulates the real environment of a typical data center are presented.

Original languageEnglish (US)
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages415-422
Number of pages8
DOIs
StatePublished - 2011
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: Jul 6 2011Jul 8 2011

Publication series

NameASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume2

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period7/6/117/8/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Smith, J. F., Abdelmaksoud, W. A., Erden, H. S., Dannenhoffer, J. F., Dang, T. Q., Khalifa, H. E., Schmidt, R. R., & Iyengar, M. (2011). Design of simulated server racks for data center research. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 415-422). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2). https://doi.org/10.1115/IPACK2011-52016