Deposition of thin metal and metal silicide films from the decomposition of organometallic compounds

P. A. Dowben, J. T. Spencer, G. T. Stauf

Research output: Contribution to journalArticle

41 Scopus citations

Abstract

The deposition of metal silicide thin films can be undertaken using volatile organometallic complexes. Organometallic vapor phase epitaxy or metal-organic chemical vapor phase epitaxy has a number of potential advantages over conventional chemical vapor deposition and molecular beam epitaxy technologies, and a number of novel thin film materials may be made from organometallic compounds. Plasma-, pyrolytic- and photolytic- assisted decomposition of organometallic complexes have been undertaken in an effort to make a variety of metallic and metal silicide thin films. These efforts are comprehensively reviewed.

Original languageEnglish (US)
Pages (from-to)297-323
Number of pages27
JournalMaterials Science and Engineering B
Volume2
Issue number4
DOIs
StatePublished - Apr 1989

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ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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