Decentralized subspace pursuit for joint sparsity pattern recovery

Gang Li, Thakshila Wimalajeewa, Pramod Kumar Varshney

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

To solve the problem of joint sparsity pattern recovery in a decentralized network, we propose an algorithm named decentralized and collaborative subspace pursuit (DCSP). The basic idea of DCSP is to embed collaboration among nodes and fusion strategy into each iteration of the standard subspace pursuit (SP) algorithm. In DCSP, each node collaborates with several of its neighbors by sharing high-dimensional coefficient estimates and communicates with other remote nodes by exchanging low-dimensional support set estimates. Experimental evaluations show that, compared with several existing algorithms for sparsity pattern recovery, DCSP produces satisfactory results in terms of accuracy of sparsity pattern recovery with much less communication cost.

Original languageEnglish (US)
Title of host publicationICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3365-3369
Number of pages5
ISBN (Print)9781479928927
DOIs
StatePublished - 2014
Event2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014 - Florence, Italy
Duration: May 4 2014May 9 2014

Other

Other2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014
CountryItaly
CityFlorence
Period5/4/145/9/14

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Keywords

  • compressive sensing
  • information fusion
  • Joint sparsity pattern recovery
  • subspace pursuit

ASJC Scopus subject areas

  • Signal Processing
  • Software
  • Electrical and Electronic Engineering

Cite this

Li, G., Wimalajeewa, T., & Varshney, P. K. (2014). Decentralized subspace pursuit for joint sparsity pattern recovery. In ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings (pp. 3365-3369). [6854224] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASSP.2014.6854224