De-embedding procedures for characterization of interconnect and package discontinuities

Tapan Kumar Sarkar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Several de-embedding techniques for modeling passive lossless devices operating in the quasi-static mode are presented. The techniques addresses problems related to the characterization of open structures under conditions of radiation occurrence and lossy transmission lines.

Original languageEnglish (US)
Title of host publicationIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Editors Anon
PublisherIEEE Computer Society
Pages173-175
Number of pages3
StatePublished - 1994
EventProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA
Duration: Nov 2 1994Nov 4 1994

Other

OtherProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging
CityMonterey, CA, USA
Period11/2/9411/4/94

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sarkar, T. K. (1994). De-embedding procedures for characterization of interconnect and package discontinuities. In Anon (Ed.), IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 173-175). IEEE Computer Society.