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Curing Mechanism and Thermal Properties of Epoxy—Imidazole Systems
M. S. Heise, G. C. Martin
Department of Biomedical & Chemical Engineering
Research output
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Contribution to journal
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Article
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peer-review
169
Scopus citations
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Dive into the research topics of 'Curing Mechanism and Thermal Properties of Epoxy—Imidazole Systems'. Together they form a unique fingerprint.
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Material Science
Thermal Property
100%
Glass Transition Temperature
100%
Differential Scanning Calorimetry
50%
Fourier Transform Infrared Spectroscopy
50%
Epoxy
50%
Chemistry
Imidazole
100%
Glass Transition Temperature
28%
Etherification
28%
Differential Scanning Calorimetry
14%
Fourier Transform Infrared Spectroscopy
14%
Ethyl
14%
Bisphenol A
14%
4-Methylimidazole
14%
Epoxy Resin
14%
Curing
14%
Keyphrases
Curing Mechanism
100%
Mechanistic Properties
100%
Tetrasubstituted Imidazoles
16%
1,2-Dimethylimidazole
16%
Individual Reactions
16%
Chemical Engineering
Etherification
100%
Differential Scanning Calorimetry
50%
Epoxy Resin
50%