Curing mechanism and network properties of epoxy - imidazole systems

M. S. Heise, G. C. Martin

Research output: Contribution to journalConference article

1 Scopus citations

Abstract

The objective of this study was to analyze the effects of the epoxy/imidazole curing chemistry on network formation. Differential Scanning Calorimetry (DSC) and heated cell Fourier Transform Infrared Spectroscopy (FTIR) were used to monitor the curing reactions. The network properties were analyzed by four different methods: dynamic DSC, extraction studies, microdielectrometry, and dynamic mechanical analysis. The network formation was then characterized by monitoring the glass transition temperature (Tg), the sol fraction, the dielectric loss factor, and the viscosity during the curing reaction. An experimental methodology for analyzing the effects of the epoxy/imidazole curing chemistry on the network properties has been developed to determine the relationships between the curing chemistry, the network structure, and the viscosity history of the resin. This methodology can be applied to study multicomponent epoxy/imidazole systems such as the DGEBA/bisphenol A/EMI-24 resin system in which the epoxy/imidazole adduct formation is the first step in the curing process.

Original languageEnglish (US)
Pages (from-to)1004-1008
Number of pages5
JournalPolymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering
Volume59
StatePublished - Dec 1 1988
EventProceedings of the ACS Division of Polymeric Materials: Science and Engineering - Fall Meeting - Los Angeles, CA, USA
Duration: Sep 26 1988Sep 30 1988

ASJC Scopus subject areas

  • Chemical Engineering (miscellaneous)
  • Polymers and Plastics

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