Correlation of viscosity, ionic conductivity, and glass transition temperature during epoxy resin curing

B. W. Fuller, J. T. Gotro, G. C. Martin

Research output: Contribution to journalConference article

4 Scopus citations

Abstract

The objective of this work was to examine the curing behavior of a high glass transition temperature (Tg) epoxy resin using a combination of rheological, thermal, and dielectric methods. The viscosity and dielectric properties were measured simultaneously during aborted isothermal and non-isothermal testing. At specified time intervals during the cure cycle, the sample was quickly removed from the rheometer oven and quenched in liquid nitrogen. Differential scanning calorimetry (DSC) was used to determine the conversion and Tg for each of the quenched samples. For isothermal curing, the ionic conductivity-Tg data was modeled using a modified Williams, Landel, Ferry (WLF) equation. Simultaneous measurement of the viscosity and dielectric loss factor during aborted isothermal and non-isothermal curing permitted correlation of the ionic conductivity, viscosity, and glass transition temperature. The ionic conductivity and Tg during isothermal curing were successfully modeled using a modified WLF equation.

Original languageEnglish (US)
Pages (from-to)975-979
Number of pages5
JournalPolymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering
Volume59
StatePublished - Dec 1 1988
EventProceedings of the ACS Division of Polymeric Materials: Science and Engineering - Fall Meeting - Los Angeles, CA, USA
Duration: Sep 26 1988Sep 30 1988

ASJC Scopus subject areas

  • Chemical Engineering (miscellaneous)
  • Polymers and Plastics

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