Chemorheological characterization of thermoset cure

A. V. Tungare, G. C. Martin, J. T. Gotro

Research output: Contribution to journalArticlepeer-review

27 Scopus citations


Thermosetting resin/glass cloth composites find extensive use in the packaging of electrical circuits into multi‐layered circuit boards. To determine optimum processing conditions, it is necessary to understand the rheology of the resin as it cures. In this study, a squeezing flow geometry was used to determine the shear viscosity of a high performance epoxy resin during cure; Viscosity profiles were obtained during rising temperature cure. The results were compared with the complex viscosities obtained using the dynamic oscillatory parallel plate geometry. A numerical optimization algorithm was used to obtain the dual Arrhenius viscosity model parameters from the experimental viscosity data. The sensitivities of the model parameters and their effects on the predicted viscosity profiles were also determined.

Original languageEnglish (US)
Pages (from-to)1071-1075
Number of pages5
JournalPolymer Engineering & Science
Issue number16
StatePublished - Aug 1988

ASJC Scopus subject areas

  • General Chemistry
  • Polymers and Plastics
  • Materials Chemistry


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