Analysis of transmission line structures using a dynamic analysis through WIPL-D

J. Stamm, T. Sarkar, B. Kolundzija, M. Salazar-Palma

Research output: Contribution to conferencePaper

Abstract

In packaging systems it is necessary to compute radiation from printed circuits. Analysis of radiation from printed circuits is quite difficult because the codes that are generally used for far fast efficient calculation of transients on these systems due to different loads are often not capable of analyzing radiation. On the other hand, dynamic solutions that calculate radiation from printed circuits often require large computational resources as it needs to calculate the electric fields from structures that are very closely spaced and thus require significant computational accuracy. What we show is that using entire domain basis one can provide accurate dynamic solutions for transmission like structures. Because in this expansion one uses an entire domain basis, the charge along the structure is continuous and therefore provides accurate values of the near fields. Typically in using an entire domain basis one can reduce the size of the matrix on large structures typically by a factor of ten. Hence large packaging problems can be solved using modest computational resources quite efficiently. Numerical results are presented to illustrate these principles.

Original languageEnglish (US)
Pages55-58
Number of pages4
StatePublished - Dec 1 2001
EventIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States
Duration: Oct 29 2001Oct 31 2001

Other

OtherIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityCambridge, MA
Period10/29/0110/31/01

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Analysis of transmission line structures using a dynamic analysis through WIPL-D'. Together they form a unique fingerprint.

  • Cite this

    Stamm, J., Sarkar, T., Kolundzija, B., & Salazar-Palma, M. (2001). Analysis of transmission line structures using a dynamic analysis through WIPL-D. 55-58. Paper presented at IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, MA, United States.