Analysis of radiation from printed circuits

Tapan K. Sarkar

doi:10.1109/EPEP.1992.572300

Analysis of radiation from printed circuits

Tapan K. Sarkar

Department of Electrical Engineering & Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 1992
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	187-189
Number of pages	3
ISBN (Electronic)	078030683X, 9780780306837
DOIs	https://doi.org/10.1109/EPEP.1992.572300
State	Published - Jan 1 1992
Event	1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States Duration: Apr 22 1992 → Apr 24 1992

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference	1992 Electrical Performance of Electronic Packaging, EPEP 1992
Country	United States
City	Tucson
Period	4/22/92 → 4/24/92

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

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10.1109/EPEP.1992.572300

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Sarkar, TK 1992, Analysis of radiation from printed circuits. in Electrical Performance of Electronic Packaging, EPEP 1992., 572300, Electrical Performance of Electronic Packaging, EPEP 1992, Institute of Electrical and Electronics Engineers Inc., pp. 187-189, 1992 Electrical Performance of Electronic Packaging, EPEP 1992, Tucson, United States, 4/22/92. https://doi.org/10.1109/EPEP.1992.572300

@inproceedings{09b6c5b23dc641d991bfe46842be7e11,

title = "Analysis of radiation from printed circuits",

abstract = "The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.",

author = "Sarkar, {Tapan K.}",

year = "1992",

month = jan,

day = "1",

doi = "10.1109/EPEP.1992.572300",

language = "English (US)",

series = "Electrical Performance of Electronic Packaging, EPEP 1992",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "187--189",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 1992",

note = "1992 Electrical Performance of Electronic Packaging, EPEP 1992 ; Conference date: 22-04-1992 Through 24-04-1992",

}

TY - GEN

T1 - Analysis of radiation from printed circuits

AU - Sarkar, Tapan K.

PY - 1992/1/1

Y1 - 1992/1/1

N2 - The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.

AB - The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.

UR - http://www.scopus.com/inward/record.url?scp=85068257539&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068257539&partnerID=8YFLogxK

U2 - 10.1109/EPEP.1992.572300

DO - 10.1109/EPEP.1992.572300

M3 - Conference contribution

AN - SCOPUS:85068257539

T3 - Electrical Performance of Electronic Packaging, EPEP 1992

SP - 187

EP - 189

BT - Electrical Performance of Electronic Packaging, EPEP 1992

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 1992 Electrical Performance of Electronic Packaging, EPEP 1992

Y2 - 22 April 1992 through 24 April 1992

ER -

Analysis of radiation from printed circuits

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

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