Analysis of radiation from printed circuits

Tapan K. Sarkar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages187-189
Number of pages3
ISBN (Electronic)078030683X, 9780780306837
DOIs
StatePublished - Jan 1 1992
Event1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States
Duration: Apr 22 1992Apr 24 1992

Publication series

NameElectrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference1992 Electrical Performance of Electronic Packaging, EPEP 1992
CountryUnited States
CityTucson
Period4/22/924/24/92

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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