Analysis of radiation from printed circuits

Tapan K. Sarkar

doi:10.1109/EPEP.1992.572300

Analysis of radiation from printed circuits

Tapan K. Sarkar

Department of Electrical Engineering & Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 1992
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	187-189
Number of pages	3
ISBN (Electronic)	078030683X, 9780780306837
DOIs	https://doi.org/10.1109/EPEP.1992.572300
State	Published - 1992
Event	1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States Duration: Apr 22 1992 → Apr 24 1992

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference	1992 Electrical Performance of Electronic Packaging, EPEP 1992
Country/Territory	United States
City	Tucson
Period	4/22/92 → 4/24/92

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPEP.1992.572300

Cite this

Sarkar, TK 1992, Analysis of radiation from printed circuits. in Electrical Performance of Electronic Packaging, EPEP 1992., 572300, Electrical Performance of Electronic Packaging, EPEP 1992, Institute of Electrical and Electronics Engineers Inc., pp. 187-189, 1992 Electrical Performance of Electronic Packaging, EPEP 1992, Tucson, United States, 4/22/92. https://doi.org/10.1109/EPEP.1992.572300

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abstract = "The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.",

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note = "Publisher Copyright: {\textcopyright} 1992 IEEE.; 1992 Electrical Performance of Electronic Packaging, EPEP 1992 ; Conference date: 22-04-1992 Through 24-04-1992",

year = "1992",

doi = "10.1109/EPEP.1992.572300",

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ER -

Analysis of radiation from printed circuits

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

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