Abstract
The objective of this presentation is to provide an overview of the mathematical techniques required to analyze arbitrary shaped printed circuits embedded in multiple lossy dielectric layers. The second objective is to present a novel deembedding technique to recover parameters of interest from numerical data.
| Original language | English (US) |
|---|---|
| Title of host publication | Electrical Performance of Electronic Packaging, EPEP 1992 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 187-189 |
| Number of pages | 3 |
| ISBN (Electronic) | 078030683X, 9780780306837 |
| DOIs | |
| State | Published - Jan 1 1992 |
| Event | 1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States Duration: Apr 22 1992 → Apr 24 1992 |
Publication series
| Name | Electrical Performance of Electronic Packaging, EPEP 1992 |
|---|
Conference
| Conference | 1992 Electrical Performance of Electronic Packaging, EPEP 1992 |
|---|---|
| Country | United States |
| City | Tucson |
| Period | 4/22/92 → 4/24/92 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Safety, Risk, Reliability and Quality
- Electronic, Optical and Magnetic Materials
Fingerprint Dive into the research topics of 'Analysis of radiation from printed circuits'. Together they form a unique fingerprint.
Cite this
Sarkar, T. K. (1992). Analysis of radiation from printed circuits. In Electrical Performance of Electronic Packaging, EPEP 1992 (pp. 187-189). [572300] (Electrical Performance of Electronic Packaging, EPEP 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1992.572300