Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards

Tapan Kumar Sarkar, Branko Kolundjiza, Antonije R. Djordjevic, Magdalena Salazar-Palma

Research output: Chapter in Book/Report/Conference proceedingChapter

7 Citations (Scopus)

Abstract

This paper presents an accurate dynamic methodology for computing the frequency responses of multilayered ground planes filled with inhomogeneous dielectric materials. Since an integral equation based method based on the free space Green's function has been utilized for computing the current distribution on the structures the edge effects from the ground planes can be accurately accounted for resulting in a more accurate model in the gigahertz regions. It provides a great flexibility in the computation of the impedance at any location between the various planes. The results have been compared with the S-parameters measured by other researchers and show good correlation up to which the measurements are available.

Original languageEnglish (US)
Title of host publicationIEEE Topical Meeting on Electrical Performance of Electronic Packaging
PublisherIEEE Computer Society
Pages59-62
Number of pages4
StatePublished - 2000
Event9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA
Duration: Oct 23 2000Oct 25 2000

Other

Other9th Topical Meeting on Electrical Performance of Electronic Packaging
CityScottsdale, AZ, USA
Period10/23/0010/25/00

Fingerprint

Scattering parameters
Green's function
Integral equations
Frequency response

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sarkar, T. K., Kolundjiza, B., Djordjevic, A. R., & Salazar-Palma, M. (2000). Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 59-62). IEEE Computer Society.

Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards. / Sarkar, Tapan Kumar; Kolundjiza, Branko; Djordjevic, Antonije R.; Salazar-Palma, Magdalena.

IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE Computer Society, 2000. p. 59-62.

Research output: Chapter in Book/Report/Conference proceedingChapter

Sarkar, TK, Kolundjiza, B, Djordjevic, AR & Salazar-Palma, M 2000, Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards. in IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE Computer Society, pp. 59-62, 9th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, USA, 10/23/00.
Sarkar TK, Kolundjiza B, Djordjevic AR, Salazar-Palma M. Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE Computer Society. 2000. p. 59-62
Sarkar, Tapan Kumar ; Kolundjiza, Branko ; Djordjevic, Antonije R. ; Salazar-Palma, Magdalena. / Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards. IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE Computer Society, 2000. pp. 59-62
@inbook{e5053ffaba12447d889acb0f66a6aba1,
title = "Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards",
abstract = "This paper presents an accurate dynamic methodology for computing the frequency responses of multilayered ground planes filled with inhomogeneous dielectric materials. Since an integral equation based method based on the free space Green's function has been utilized for computing the current distribution on the structures the edge effects from the ground planes can be accurately accounted for resulting in a more accurate model in the gigahertz regions. It provides a great flexibility in the computation of the impedance at any location between the various planes. The results have been compared with the S-parameters measured by other researchers and show good correlation up to which the measurements are available.",
author = "Sarkar, {Tapan Kumar} and Branko Kolundjiza and Djordjevic, {Antonije R.} and Magdalena Salazar-Palma",
year = "2000",
language = "English (US)",
pages = "59--62",
booktitle = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",
publisher = "IEEE Computer Society",
address = "United States",

}

TY - CHAP

T1 - Accurate modeling of frequency responses of multiple planes in gigahertz packages and boards

AU - Sarkar, Tapan Kumar

AU - Kolundjiza, Branko

AU - Djordjevic, Antonije R.

AU - Salazar-Palma, Magdalena

PY - 2000

Y1 - 2000

N2 - This paper presents an accurate dynamic methodology for computing the frequency responses of multilayered ground planes filled with inhomogeneous dielectric materials. Since an integral equation based method based on the free space Green's function has been utilized for computing the current distribution on the structures the edge effects from the ground planes can be accurately accounted for resulting in a more accurate model in the gigahertz regions. It provides a great flexibility in the computation of the impedance at any location between the various planes. The results have been compared with the S-parameters measured by other researchers and show good correlation up to which the measurements are available.

AB - This paper presents an accurate dynamic methodology for computing the frequency responses of multilayered ground planes filled with inhomogeneous dielectric materials. Since an integral equation based method based on the free space Green's function has been utilized for computing the current distribution on the structures the edge effects from the ground planes can be accurately accounted for resulting in a more accurate model in the gigahertz regions. It provides a great flexibility in the computation of the impedance at any location between the various planes. The results have been compared with the S-parameters measured by other researchers and show good correlation up to which the measurements are available.

UR - http://www.scopus.com/inward/record.url?scp=0034505506&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034505506&partnerID=8YFLogxK

M3 - Chapter

SP - 59

EP - 62

BT - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

PB - IEEE Computer Society

ER -