A thermal-driven force-directed floorplanning algorithm for 3D ICs 1

Yun Huang, Qiang Zhou, Yici Cai, Haixia Yan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

The three-dimensional (3D) integration circuit is a new technology with higher integration density. To solve the critical thermal issue in 3D layout, we propose a thermal-driven force-directed floorplanning algorithm. Based on the characteristic of the different stages of floorplanning, this algorithm applies different methods to calculate the thermal distribution to reach a tradeoff between time efficiency and accuracy. And a new effective strategy of the layer assignment is used in which we consider the area, the overlaps and the power densities simultaneously. Experimental results show that, compared with the recent thermal-driven force-directed 3D floorplanner, it averagely decreases the temperature by 8% and runtime by 10.7% while only increases the area and wirelength by 3% at most.

Original languageEnglish (US)
Title of host publicationProceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009
Pages497-502
Number of pages6
DOIs
StatePublished - Nov 17 2009
Event2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009 - Huangshan, China
Duration: Aug 19 2009Aug 21 2009

Publication series

NameProceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009

Other

Other2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009
CountryChina
CityHuangshan
Period8/19/098/21/09

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Software

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    Huang, Y., Zhou, Q., Cai, Y., & Yan, H. (2009). A thermal-driven force-directed floorplanning algorithm for 3D ICs 1. In Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009 (pp. 497-502). [5246852] (Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009). https://doi.org/10.1109/CADCG.2009.5246852