A thermal-driven force-directed floorplanning algorithm for 3D ICs 1

Yun Huang; Qiang Zhou; Yici Cai; Haixia Yan

doi:10.1109/CADCG.2009.5246852

A thermal-driven force-directed floorplanning algorithm for 3D ICs ¹

Yun Huang, Qiang Zhou, Yici Cai, Haixia Yan

Research output: Chapter in Book/Entry/Poem › Conference contribution

6 Scopus citations

Abstract

The three-dimensional (3D) integration circuit is a new technology with higher integration density. To solve the critical thermal issue in 3D layout, we propose a thermal-driven force-directed floorplanning algorithm. Based on the characteristic of the different stages of floorplanning, this algorithm applies different methods to calculate the thermal distribution to reach a tradeoff between time efficiency and accuracy. And a new effective strategy of the layer assignment is used in which we consider the area, the overlaps and the power densities simultaneously. Experimental results show that, compared with the recent thermal-driven force-directed 3D floorplanner, it averagely decreases the temperature by 8% and runtime by 10.7% while only increases the area and wirelength by 3% at most.

Original language	English (US)
Title of host publication	Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009
Pages	497-502
Number of pages	6
DOIs	https://doi.org/10.1109/CADCG.2009.5246852
State	Published - 2009
Externally published	Yes
Event	2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009 - Huangshan, China Duration: Aug 19 2009 → Aug 21 2009

Publication series

Name	Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009

Other

Other	2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009
Country/Territory	China
City	Huangshan
Period	8/19/09 → 8/21/09

ASJC Scopus subject areas

Computer Graphics and Computer-Aided Design
Software

Access to Document

10.1109/CADCG.2009.5246852

Cite this

Huang, Y., Zhou, Q., Cai, Y., & Yan, H. (2009). A thermal-driven force-directed floorplanning algorithm for 3D ICs ¹. In Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009 (pp. 497-502). Article 5246852 (Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009). https://doi.org/10.1109/CADCG.2009.5246852

A thermal-driven force-directed floorplanning algorithm for 3D ICs ¹. / Huang, Yun; Zhou, Qiang; Cai, Yici et al.
Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009. 2009. p. 497-502 5246852 (Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009).

Research output: Chapter in Book/Entry/Poem › Conference contribution

Huang, Y, Zhou, Q, Cai, Y & Yan, H 2009, A thermal-driven force-directed floorplanning algorithm for 3D ICs ¹. in Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009., 5246852, Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009, pp. 497-502, 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009, Huangshan, China, 8/19/09. https://doi.org/10.1109/CADCG.2009.5246852

Huang Y, Zhou Q, Cai Y, Yan H. A thermal-driven force-directed floorplanning algorithm for 3D ICs ¹. In Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009. 2009. p. 497-502. 5246852. (Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009). doi: 10.1109/CADCG.2009.5246852

Huang, Yun ; Zhou, Qiang ; Cai, Yici et al. / A thermal-driven force-directed floorplanning algorithm for 3D ICs ¹. Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009. 2009. pp. 497-502 (Proceedings - 2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics, CAD/Graphics 2009).

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