TY - JOUR
T1 - A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting
AU - Bulut, Aysun
AU - Wörle, Michael
AU - Zorlu, Yunus
AU - Kirpi, Erdogan
AU - Kurt, Huseyin
AU - Zubieta, Jon
AU - Grabowsky, Simon
AU - Beckmann, Jens
AU - Yücesan, Gündoǧ
N1 - Funding Information:
This work has been supported by TÜBITAK grant 212T060 and COST action TD 1304. SG acknowledges the German Research Foundation for grant GR4451/1-1.
Publisher Copyright:
© International Union of Crystallography, 2017.
PY - 2017/4/1
Y1 - 2017/4/1
N2 - The reaction of appropriate copper and vanadium salts with tetratopic methane tetra-p-phenylphosphonic acid (MTPPA) in the presence of 2,2':6':2''-terpyridine (terpy) yielded the three-dimensional bimetallic copper vanadium phosphonate framework[{Cu(terpy)}4Cu(VO2)4(MTPPA-H)2]·4H2O (1). Terpy has no net contribution to the three-dimensional structure providing a potential platform for void space formation via mold-casting. The structure was characterized by single-crystal X-ray diffraction and thermogravimetric analysis (TGA). Magnetic measurements were performed using a SQUID magnetometer. The crystal structure of the methanol solvate of the free ligand, MTPPA·MeOH, was analysed using Hirshfeld surfaces and fingerprint plots.A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting is reported.
AB - The reaction of appropriate copper and vanadium salts with tetratopic methane tetra-p-phenylphosphonic acid (MTPPA) in the presence of 2,2':6':2''-terpyridine (terpy) yielded the three-dimensional bimetallic copper vanadium phosphonate framework[{Cu(terpy)}4Cu(VO2)4(MTPPA-H)2]·4H2O (1). Terpy has no net contribution to the three-dimensional structure providing a potential platform for void space formation via mold-casting. The structure was characterized by single-crystal X-ray diffraction and thermogravimetric analysis (TGA). Magnetic measurements were performed using a SQUID magnetometer. The crystal structure of the methanol solvate of the free ligand, MTPPA·MeOH, was analysed using Hirshfeld surfaces and fingerprint plots.A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting is reported.
KW - Hirshfeld surfaces
KW - bimetallic Cu-V frameworks
KW - metal organic frameworks (MOFs)
KW - organophosphonate complexes
KW - void space formation
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U2 - 10.1107/S2052520617000245
DO - 10.1107/S2052520617000245
M3 - Article
C2 - 28362294
AN - SCOPUS:85017187346
VL - 73
SP - 296
EP - 303
JO - Acta Crystallographica Section B: Structural Science, Crystal Engineering and Materials
JF - Acta Crystallographica Section B: Structural Science, Crystal Engineering and Materials
SN - 2052-5192
IS - 2
ER -