A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting

Aysun Bulut, Michael Wörle, Yunus Zorlu, Erdogan Kirpi, Huseyin Kurt, Jon Zubieta, Simon Grabowsky, Jens Beckmann, Gündoǧ Yücesan

Research output: Contribution to journalArticle

10 Scopus citations

Abstract

The reaction of appropriate copper and vanadium salts with tetratopic methane tetra-p-phenylphosphonic acid (MTPPA) in the presence of 2,2':6':2''-terpyridine (terpy) yielded the three-dimensional bimetallic copper vanadium phosphonate framework[{Cu(terpy)}4Cu(VO2)4(MTPPA-H)2]·4H2O (1). Terpy has no net contribution to the three-dimensional structure providing a potential platform for void space formation via mold-casting. The structure was characterized by single-crystal X-ray diffraction and thermogravimetric analysis (TGA). Magnetic measurements were performed using a SQUID magnetometer. The crystal structure of the methanol solvate of the free ligand, MTPPA·MeOH, was analysed using Hirshfeld surfaces and fingerprint plots.A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting is reported.

Original languageEnglish (US)
Pages (from-to)296-303
Number of pages8
JournalActa Crystallographica Section B: Structural Science, Crystal Engineering and Materials
Volume73
Issue number2
DOIs
StatePublished - Apr 1 2017

Keywords

  • bimetallic Cu-V frameworks
  • Hirshfeld surfaces
  • metal organic frameworks (MOFs)
  • organophosphonate complexes
  • void space formation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Metals and Alloys
  • Materials Chemistry

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