Abstract
The reaction of appropriate copper and vanadium salts with tetratopic methane tetra-p-phenylphosphonic acid (MTPPA) in the presence of 2,2':6':2''-terpyridine (terpy) yielded the three-dimensional bimetallic copper vanadium phosphonate framework[{Cu(terpy)}4Cu(VO2)4(MTPPA-H)2]·4H2O (1). Terpy has no net contribution to the three-dimensional structure providing a potential platform for void space formation via mold-casting. The structure was characterized by single-crystal X-ray diffraction and thermogravimetric analysis (TGA). Magnetic measurements were performed using a SQUID magnetometer. The crystal structure of the methanol solvate of the free ligand, MTPPA·MeOH, was analysed using Hirshfeld surfaces and fingerprint plots.A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting is reported.
Original language | English (US) |
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Pages (from-to) | 296-303 |
Number of pages | 8 |
Journal | Acta Crystallographica Section B: Structural Science, Crystal Engineering and Materials |
Volume | 73 |
Issue number | 2 |
DOIs | |
State | Published - Apr 1 2017 |
Keywords
- Hirshfeld surfaces
- bimetallic Cu-V frameworks
- metal organic frameworks (MOFs)
- organophosphonate complexes
- void space formation
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Metals and Alloys
- Materials Chemistry