A new paradigm for trading off yield, area and performance to enhance performance per wafer

Yue Gao, Melvin A. Breuer, Yanzhi Wang

Research output: Chapter in Book/Entry/PoemConference contribution

6 Scopus citations

Abstract

In this paper we outline a novel way to 1) predict the revenue associated with a wafer, 2) maximize the projected revenue through unconventional yield enhancement techniques, and 3) produce dice from the same mask that may have different performances and selling prices. Unlike speed binning, such heterogeneity is intentional by design. To achieve these goals we overturn the traditional concepts of redundancy, and present a novel design flow for yield enhancement called "Reduced Redundancy Insertion", where spares can potentially have less area and performance than their fathers. We develop a model for the revenue associated with the new design methodology that integrates system configuration and leverages yield, area and performance. The primary metric used in this model is termed "Expected Performance per Area", which is a measure that can be reliably estimated for different system architectures, and can be maximized by using algorithms proposed in this paper. We present theoretical models and case studies that characterize our designs, and experimental results that validate our prediction. We show that using Reduced Redundancy can improve wafer revenue by 10-30%.

Original languageEnglish (US)
Title of host publicationProceedings - Design, Automation and Test in Europe, DATE 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1753-1758
Number of pages6
ISBN (Print)9783981537000
DOIs
StatePublished - 2013
Externally publishedYes
Event16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013 - Grenoble, France
Duration: Mar 18 2013Mar 22 2013

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Other

Other16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013
Country/TerritoryFrance
CityGrenoble
Period3/18/133/22/13

ASJC Scopus subject areas

  • General Engineering

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