• Source: Scopus
  • Calculated based on no. of publications stored in Pure and citations from Scopus
1983 …2021

Research activity per year

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Network

Abdullah Eroglu

  • Syracuse University
  • MKS Instruments
  • Indiana University-Purdue University Indianapolis
  • Indiana University - Purdue University
  • Dept. of Electrical & Computer Engineering
  • Department of Engineering
  • Department of Engineering
  • Indiana University Bloomington
  • Indiana University Fort Wayne
  • MKS Instruments

External person

Kepei Sun

  • Syracuse University
  • Becton Dickinson and Co.
  • Electrical Engineering and Computer Science Department
  • Department of Electrical Engineering and Computer Sciences

External person

Ercument Arvas

  • Syracuse University
  • Rochester Institute of Technology
  • University, NY, USA
  • Department of Electrical Engineering and Computer Science
  • Dept. of Electrical & Computer Engineering
  • Department of Electrical Engineering
  • Rochester Inst of Technology, Dep of
  • Dep of Electr Eng, Syracuse
  • Department of Electrical Engineering
  • Dept. of Electrical System

External person

Kevin Xu

  • SUNY Buffalo
  • Department of Electrical Engineering

External person

Jun H. Choi

  • Department of Electrical Engineering
  • SUNY Buffalo
  • Syracuse University

External person

Henri J. Lezec

  • National Institute of Standards and Technology
  • Center for Nanoscale Science and Technology

External person

Vladimir Okhmatovski

  • University of Manitoba
  • Department of Electrical and Computer Engineering

External person

Komlan Payne

  • Syracuse University
  • Electrical Engineering and Computer Science Department

External person

Brian J. Rautio

  • Syracuse University
  • Sonnet Software
  • Sonnet Software
  • LC Smith College of Engineering and Computer Science

External person

Amit Agrawal

  • National Institute of Standards and Technology
  • University of Maryland, College Park
  • Center for Nanoscale Science and Technology
  • Maryland Nanocenter

External person

Ying Huang

  • Syracuse University
  • Department of Electrical Engineering and Computer Science
  • Anaren Microwave, Inc.
  • Department of Electrical Engineering and Computer Sciences
  • Department of EECS

External person

Matthew S. Davis

  • Center for Nanoscale Science and Technology
  • Maryland Nanocenter
  • National Institute of Standards and Technology
  • Syracuse University
  • University of Maryland, College Park

External person

Eunseok Park

  • Syracuse University
  • Samsung
  • Samsung Advanced Institute of Technology
  • Dept. of Electrical & Computer Engineering
  • Samsung Advanced Institute of Technology

External person

S. Mudaliar

  • United States Air Force Academy
  • Syracuse University
  • ARCON Corp

External person

Gregory F. Pettis

  • Harris Corporation - RF Communications Division
  • Harris Corporation
  • Harris RF Communications
  • Harris RF Communications Division

External person

Mohsen Yazdani

  • Syracuse University

External person

Jin Au Kong

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Computer Science and Research Laboratory of Electronics

External person

Matthew S. Davis

  • National Institute of Standards and Technology
  • Syracuse University
  • University of Maryland, College Park
  • Center for Nanoscale Science and Technology
  • Maryland Nanocenter

External person

Wenqi Zhu

  • National Institute of Standards and Technology
  • University of Maryland, College Park
  • Center for Nanoscale Science and Technology
  • Maryland Nanocenter

External person

Joseph R. Mautz

  • Syracuse University
  • Dept. of Electrical & Computer Engineering

External person

Steve Blair

  • Department of Electrical and Computer Engineering
  • University of Utah

External person

Seungyup Rhee

  • Chonnam National University
  • Dept. of Electronic Communication

External person

M. Hasanovic

  • Syracuse University
  • Department of Electrical Engineering

External person

C. Mei

  • Syracuse University
  • Department of Electrical Engineering

External person

Jared Strait

  • Center for Nanoscale Science and Technology
  • National Institute of Standards and Technology

External person

A. F. Yagli

  • Konya Yolu 40.km Golbasi
  • Turksat

External person

Won Ha Choe

  • Syracuse University
  • Dept. of Electrical & Computer Engineering

External person

Michael D. Enders

  • Syracuse University
  • Anaren Microwave, Inc.
  • Anaren, Inc.

External person

Jun H. Choi

  • Syracuse University

External person

E. C. Wayton

  • Syracuse University

External person

Serhend Arvas

  • Syracuse University

External person

T. Jang

  • JMA Wireless

External person

Youngtack Hong

  • Samsung
  • Samsung Advanced Institute of Technology

External person

Harvey K. Schuman

  • Syracuse Research Corporation

External person

Heidary, Kaveh

  • Matrix Technologies

External person

Atef Z. Elsherbeni

  • University of Mississippi
  • Department of Electrical Engineering

External person

Gokhan Aydin

  • Syracuse University
  • Department of Electrical Engineering and Computer Science

External person

Ting Xu

  • Nanjing University
  • National Laboratory of Solid State Microstructures

External person

Andreas C. Cangellaris

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

J. A. Kong

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science

External person

Rautio, James C.

  • Sonnet Software

External person

Sanghyun Han

  • Syracuse University

External person

L. Bamford

  • JMA Wireless

External person

Jeong Bong Lee

  • University of Texas at Dallas

External person

Richard Tanski

  • Qualcomm Incorporated
  • Syracuse University

External person

N. Sundararajan

  • JMA Wireless

External person

Yun H. Lee

  • Telecommunication R and D Center
  • Samsung

External person

Dojana Salama

  • Syracuse University

External person

Yun Hee Lee

  • Syracuse University

External person

Arlon T. Adams

  • IBM
  • Syracuse University
  • Matrix Technologies
  • Dept. of Electrical & Computer Engineering
  • Department of Electrical Engineering

External person

Tae Hoon Yoo

  • Syracuse University

External person

Yun Hee Lee

  • Syracuse University
  • Samsung
  • Telecommunication R and D Center

External person

Amit Agrawal

  • Center for Nanoscale Science and Technology
  • Maryland Nanocenter
  • National Institute of Standards and Technology
  • University of Maryland, College Park

External person

Jin Au Kong

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering

External person

Clifford M. Krowne

  • Naval Research Laboratory
  • Microwave Technology Branch

External person

Fatih Kaburcuk

  • Syracuse University

External person

Jeremy Furgal

  • Syracuse University

External person