Media coverage
1
Media coverage
Title Samsung breaks ground on chip R&D centre, plans $15 bn investment Media name/outlet Telecomlead.com Country/Territory India Date 8/19/22 Persons Jay Kyoon Lee
Press/Media: Expert Comment
Media coverage
Title | Samsung breaks ground on chip R&D centre, plans $15 bn investment |
---|---|
Media name/outlet | Telecomlead.com |
Country/Territory | India |
Date | 8/19/22 |
Persons | Jay Kyoon Lee |